Eggtimer Rocketry Flight Computer Bedienungsanleitung Seite 14

  • Herunterladen
  • Zu meinen Handbüchern hinzufügen
  • Drucken
  • Seite
    / 31
  • Inhaltsverzeichnis
  • FEHLERBEHEBUNG
  • LESEZEICHEN
  • Bewertet. / 5. Basierend auf Kundenbewertungen
Seitenansicht 13
top of the module so that it securely holds the GPS module in place. Gently tap the GPS
module, it should not move; if it does, repeat the procedure with a new piece of masking tape.
__ DOUBLE-CHECK that the GPS module is properly oriented, and that the pads are
centered on the PC board’s pads. A jeweler’s loupe or small 10x magnifier is very handy for
this purpose.
__ Using as little solder as possible, solder ONLY the pad at the upper-right corner of the
GPS module. Use only enough solder to get the GPS pad mounted to the board, it won’t take
very much. You should hold the iron for about 5 seconds after the solder flows, then remove
the heat and wait at least 30 seconds before you touch anything. If you do this right, you
should see a nice shiny solder joint filling in the gap between the PC board and the GPS
module’s pad, with a slight radius as it transitions from the board up to the GPS module’s pad.
The solder should just fill in the half-moon on the side of the GPS module’s pad.
Refer to the picture of this step on the Eggtimer Rocketry web site for details,
http://www.eggtimerrocketry.com/page16.php?view=preview&category=7&image=92
__ CHECK AGAIN that the GPS module is properly oriented and that the pads are
centered on the PC board’s pads. Make sure that solder wicks up to the “half moon” in the
GPS pad. If the GPS module moved a little during soldering, heat up the solder joint and
GENTLY move it into place. If you cannot get it to move without removing it, remove the
masking tape, heat up the solder joint, then GENTLY lift the module from the board. Get a
new piece of masking tape, and try again.
__ Once you have successfully soldered the upper-right corner pad and confirmed that the
module is properly oriented on the board, repeat the procedure for the other three corners in
this order: Lower-Left Corner, Upper-Left Corner, Lower-Right Corner. Be sure to wait at
least 30 seconds between each solder joint to allow the module to cool down.
__ Remove the masking tape from the GPS module, and remove the masking tape holding
the board to your work surface. Turn the module over, and with two new pieces of masking
tape tack it down to your work surface so it will not move (yes, it will be upside-down).
You will now be soldering those eight square pads on the bottom of the GPS module to the PC
board. You will see that there are eight square pads with holes in the middle, these are aligned
with the square pads on the GPS module. What you are going to be doing is to flow solder
down those holes onto the pads, so that they are bonded to the board. Please read this
procedure carefully BEFORE you start soldering, it is important that you do not overheat the
pads on the GPS module.
__ Melt some solder onto the UPPER-LEFT PAD and hold the iron close to the hole,
melting the solder that you had previously flowed into the hole. Keep the iron there for about
10 seconds; if the solder gets sucked down into the hole (which is a good thing because that
means that it’s getting on the GPS pad below), add a little more. When you’re satisfied that the
solder has melted onto the GPS pad, remove the iron and let the board cool for at least 30
seconds.
Seitenansicht 13
1 2 ... 9 10 11 12 13 14 15 16 17 18 19 ... 30 31

Kommentare zu diesen Handbüchern

Keine Kommentare